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		<title>Samsung améliore la fabrication de ses puces 2.5D en 7 nm</title>
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		<title>Cascade Lake fuit dans le noyau Linux, le multi-die à l&#8217;honneur !</title>
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		<pubDate>Fri, 22 Feb 2019 15:10:14 +0000</pubDate>
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					<description><![CDATA[Enfin des chiplets chez Intel, mais pas pour le grand public.]]></description>
		
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		<title>Vers des GPU multi-die chez NVIDIA ?</title>
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		<pubDate>Wed, 05 Jul 2017 06:05:00 +0000</pubDate>
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					<description><![CDATA[Le caméléon travaille en douche sur des plan d'architecture mutli module : vers la fin du SLI classique ?]]></description>
		
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